【日美磋商半导体工厂项目 价值数万亿日元】金色财经报道，9月17日，据日经新闻报道，日美两国政府正就建设一座半导体工厂展开磋商，该项目是双方在关税谈判中达成的5500亿美元（约合85万亿日元）对美投资计划的一部分，预计价值数万亿日元。此前对美投资主要集中在发电领域，如今将转向高科技制造业。运营将由半导体代工巨头美国全球晶圆（GlobalFoundries）负责。上述消息由日美双方谈判代表透露。(金十)
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